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Published: 2026-03-26 16:11:07 CET
Nasdaq Stockholm AB - Bond Market information

CORRECTION: Listing of bond issued by Tempcon Group AB on STO Corporate Bonds and delisting from STO FN Transfer Market

CORRECTION: short name 

At the request of Tempcon Group AB, the trading in the company's bond listed on Nasdaq STO FN Transfer Market is to cease. From March 27, 2026, the bond will instead be traded on STO Corporate Bonds.
 

ISIN    SE0023971254
Trading code    TEMP550MSEK2029
Short name    TEMP550MSEK 2029
Long name    Tempcon Group AB 550M SEK 2029


Nasdaq Stockholm AB, Issuer Surveillance, dl-ilasto@nasdaq.com, 46 8 405 7280